Connecting the advanced packaging community.

About AP International

Connecting the Advanced Packaging Industry

The 2nd Advanced Packaging International builds on the huge success of the 2026 launch event and the momentum driving the next era of semiconductor innovation. Over two days, industry leaders and academic experts will deliver around 40 presentations across key themes:

• Chiplets & Heterogeneous Integration
• Scaling & Pilot Lines
• Equipment
• Materials
• Thermal Management & Reliability
• Design & Simulation

Conference attendees will gain insights into the materials, methods and technologies reshaping chip-level packaging and system integration. From cutting-edge thermal solutions to the reimagining of wirebond and leadframe formats, the event provides a comprehensive look at how packaging is enabling system-level innovation.

The two-day conference also includes expert panels and a dedicated poster session, creating multiple avenues for peer-to-peer engagement and technical exchange across the packaging ecosystem, from researchers and R&D teams to product engineers and system architects.

AP International is part of AngelTech, bringing together an Innovation Summit, four co-located conferences and an exhibition with more than 120 presentations, more than 850 attendees and over 80 exhibitors. AngelTech is the only global event covering Compound Semiconductor, PICs, Power Electronics and Advanced Packaging technologies, bringing key executives together under one roof for three days of networking and insight.